1、 Technical principle: 3D heat pipe reconstruction of thermal conduction path
1. The bottleneck of traditional heat pipes
The U-shaped heat pipe only transfers heat through both ends, resulting in a "low temperature blind spot" in the center of the fins and limited heat dissipation efficiency.
2. 3DHP Core Innovation
Fork shaped three terminal structure: adds a vertical central branch, covering the area directly above the CPU hotspot
Zero bending design: The central heat pipe is vertically inserted into the fins to avoid capillary force attenuation
Thermal balance optimization: Non centered layout avoids the highest temperature point and balances the three end loads
2、 Product implementation: V-series graded heat dissipation solution
model
Heat pipe configuration
Antipyretic ability
Core Features
V4
2 8mm 3DHP
220W
Single tower and double tower, ITX compatible
V6
3 pieces of 6mm 3DHP
260W
Optimize wind pressure fan blades
V8
4 pieces of 6mm 3DHP
340W
Micro slit twin tower, 28.5dBA low noise
V10
5 pieces of 6mm 3DHP
340W+
Industrial grade fan, extreme overclocking
3、 Performance advantage test
Temperature control: V8/V10 is 5-8 ° C lower than traditional 6-heat pipes
Noise optimization: Only 28.5dBA at full load (approximately 32dBA for competitors in the same class)
Cost effectiveness: 2 3DHP heat pipes achieve the efficiency of 4 traditional heat pipes
4、 Industry breakthroughs and challenges
1. Technological Disruption
Compared to Noctua's "square bottom heat pipe": suspended design does not increase the base area
Superior to Palit "Double U": Zero bending ensures efficient flow of working fluid
2. Manufacturing difficulties
Three end welding requires precise control of wall thickness and sintering powder distribution
By 2025, solve the problem of mass production yield through automated production lines
5、 Future Evolution Direction
4D/5D heat pipe array: increasing heat pipe coverage density
AI temperature control integration: linked with MasterPlus+software
Next generation CPU adaptation: Arrow Lake-S supporting TDP breakthrough of 350W
