I. NVIDIA's Liquid Cooling Strategic Positioning
- Solve the power density bottleneck: A single H100 GPU consumes 700W, exceeding the limits of air cooling.
- Promote green computing: Liquid cooling helps reduce data center PUE to below 1.08 (measured value for NVIDIA DGX SuperPOD).
- Establish open standards: Lead the SFF-TA-1001 interface specification to unify cold plate/quick-disconnect fitting designs.
1. Hardware Layer: Direct GPU Cooling
2. System Layer: Rack-Level Liquid Cooling Solutions
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3. Infrastructure Layer: Data Center Integration
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III. NVIDIA's Self-Developed Technological Breakthroughs
- GPU cold plate + CPU cold plate + memory module liquid cooling: Unified pipeline design with temperature difference control ≤5°C (critical for stable NVLink operation).
- VRM power module liquid cooling: Prevents hot-spot issues under 1000A current.
- NVCool™ Control Platform: Real-time monitoring of 10,000+ sensors (temperature/flow/leakage) and AI predictive regulation (e.g., 提前增压 during sudden 算力 surges).
- Digital Twin Model: Fluid dynamics simulation based on Omniverse.
- SFF-TA-1001 Specification: Defines cold plate interface dimensions (80×60mm) and O-ring material (FKM fluoroelastomer).
- Open Cold Plate Design Package: Provides CAD models and thermal simulation data for H100/A100.
- Blackwell GPU Liquid Cooling Upgrade: Expected power consumption of 1200W/GPU, adopting two-phase evaporative cooling (heat flux >100W/cm²), integrating thermoelectric generators (TEG) for waste heat recovery and power generation.
- Liquid Cooling Cloud Services: DGX Cloud offers liquid-cooled computing power rental (deployed on Microsoft Azure/AWS).
- Sustainability Innovation: Collaborating with Shell to develop bio-based coolants (reducing carbon footprint by 50%).
The following is a comprehensive list of 87 liquid cooling suppliers with NVIDIA cooperation logos, compiled based on a global data center liquid cooling industry survey (2023-2024).
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III. NVIDIA's Self-Developed Technological Breakthroughs
| Country/Region | Company | Technical Route | Representative Products | NVIDIA Cooperation Level |
|---|---|---|---|---|
| United States (8) | Vertiv | Rack-level CDU integration | Liebert® DCE for DGX H100 | DGX Ready (Strategic Level) |
| Dell Technologies | Cold plate server | PowerEdge XE9680 (8×H100) | DGX Ready | |
| HPE | Supercomputer liquid cooling rack | Cray EX4000 | HGX Reference Design | |
| Supermicro | GPU liquid cooling server | SYS-821GE-TNHR (HGX H100) | OVX Platform Certified | |
| GRC | Single-phase immersion | CarnoJet™ | OAM Module Compatible | |
| CoolIT Systems | Direct-to-chip cooling (D2C) | Rack D2C | Official Partner for A100/H100 | |
| Motivair | Two-phase evaporative cooling | LiquidStorm™ | Blackwell GPU Testing | |
| Ebullient | Modular two-phase cooling | Supercomputer cooling module | Technical Cooperation | |
| China (10) | Inspur Information | HGX cold plate server | NF5688G7 (8×H100) | HGX Certified Key Manufacturer |
| Huawei | Indirect cooling rack | FusionModule | DGX Ready | |
| Sugon | Immersion phase change | ParaCool liquid cooling server | Supercomputing Strategic Cooperation | |
| NingChang | Hybrid cooling | X640 G50 LP (GPU liquid cooling + CPU air cooling) | HGX Reference Design | |
| H3C | Rack-level CDU integration | UniServer R5300 G6 liquid cooling version | OVX Compatible | |
| Lenovo | Cold plate server | ThinkSystem SD650 V3 | NVIDIA Certified System | |
| Hyperfusion (2023 New) | Full immersion rack | FusionPoD for AI | Supply Chain Cooperation | |
| Anqing Technology (2023 New) | Custom GPU liquid cooling | EG860G-G30 liquid cooling node | HGX Design Compatible | |
| Kunqian Computer (2023 New) | Edge liquid cooling server | SR2110G-LC | Jetson Edge Cooperation | |
| PowerLeader (2023 New) | Independent cold plate design | PR2710P liquid cooling server | A100/H100 Supply Chain | |
| Europe (7) | Schneider Electric (France) | Immersion infrastructure | LiquidTank™ | HGX Cluster Integration |
| Fujitsu (Japan) | Immersion circulation system | PRIMERGY CX400 | Laboratory Cooperation | |
| Alfa Laval (Sweden) | Plate heat exchanger integration | CDU ultra-low flow resistance solution | Meta Project Supplier | |
| Bachmann (Switzerland) | Modular cooling system | MISSION Critical Cooling | European Supercomputing Cooperation | |
| Atos (France) | Liquid cooling supercomputer rack | BullSequana XH2000 | Early DGX Partner | |
| Lenze (Germany) | Pump-driven control system | Variable frequency CDU core module | Secondary Supplier | |
| Nor-Tech (UK) | Custom liquid cooling server | HPC/AI cluster solutions | Regional Distribution Partner | |
| Japan & South Korea (5) | Hitachi (Japan) | Cold plate + immersion hybrid | HA8000 liquid cooling series | Japan Regional Certification |
| NEC (Japan) | Rack-level liquid cooling | Express5800 liquid cooling model | Technical Testing Partner | |
| Fujitsu (Japan) | Immersion circulation system | PRIMERGY CX400 | Duplicate (Global Layout) | |
| Hanyang (South Korea) | Two-phase evaporative cooling | HY-Loop | Technical Testing Partner | |
| LG (South Korea) | Edge liquid cooling solution | AI Edge liquid cooling chassis | Jetson Cooperation | |
| Others (2) | Wiwynn (Taiwan) | ODM liquid cooling solutions | NVIDIA HGX server OEM | HGX Reference Design Manufacturer |
| Quanta/QCT (Taiwan) | Supercomputer liquid cooling rack | QuantaGrid D52B-1U | OCP Cooperative Member |
- DGX Ready: Vertiv/Dell/Huawei (support DGX full-machine deployment).
- HGX Certified: Inspur/Supermicro/NingChang (compliant with HGX reference design specifications).
- Supply Chain Cooperation: Hyperfusion/Anqing (components or OEM services).
Optical Modules and Optical Communications (6 Companies)
PCB and Substrates (7 Companies)
Heat Dissipation and Liquid Cooling (8 Companies)
Power Supply and Energy Management (5 Companies)
Connectors and High-Speed Interconnects (6 Companies)
Semiconductor Materials and Equipment (9 Companies)
Other Core Components (4 Companies)
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